定价： 345元 / 折扣价： 294 元 加购物车

定价： 345元 / 折扣价： 294 元 加购物车

定价： 605元 / 折扣价： 515 元 加购物车

定价： 0元 / 折扣价： 0 元 加购物车

定价： 0元 / 折扣价： 0 元 加购物车

定价： 260元 / 折扣价： 221 元 加购物车

定价： 260元 / 折扣价： 221 元 加购物车

定价： 605元 / 折扣价： 515 元 加购物车

定价： 605元 / 折扣价： 515 元 加购物车

定价： 156元 / 折扣价： 133 元 加购物车

定价： 156元 / 折扣价： 133 元 加购物车

定价： 1274元 / 折扣价： 1083 元

定价： 1229元 / 折扣价： 1045 元

This specification covers design and construction, physical properties, and performance requirements for cooktops which utilize induction as a means for cooking and warming food in commercial and institutional food service establishments. Included are tabletop units, drop-in units and floor standing equipment with integral induction hobs. Testing methods include temperature control accuracy test, dry pan test, minimum load detection test, operating power test, and induction cooktop efficiency test.1.1 This specification covers cooktops which utilize induction as a means for cooking and warming food in commercial and institutional food service establishments. Included are tabletop units, drop-in units and floor standing equipment with integral induction hobs.1.2 The values stated in inch-pound units are to be regarded as the standard. The SI values given in parentheses are provided for information only.1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.1.4 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

定价： 515元 / 折扣价： 438 元 加购物车

4.1 The existing Test Method F1995, while very useful, is difficult to conduct if an encapsulating dome is applied, and does not reveal the possible failures caused by mechanical stress incompatibility in the overall SMT joint. This mandrel bend test will reveal possible mechanical stress incompatibility between the various adhesives which can result in latent field failures during production handling or with thermal cycling in normal use.4.2 The existing Test Method F2750 does not include specifics for SMD attachments and only addresses the conductivity change of the conductive trace.4.3 The different combinations of SMD types, attachment medias, circuit substrates and process variation can account for significant variation in test outcome.4.4 Bending of printed flexible circuit or their components can affect their visual appearance, mechanical integrity or electrical functionality. This test method simulates conditions that may be seen during manufacture, installation, or use.4.5 Bend testing may be destructive, therefore any samples tested should be considered unfit for future use.1.1 This test method covers a means to test a completed Surface Mounted Device (SMD) joint for bond strength and inter-layer stress compatibility1.2 A completed SMD joint includes; SMD (LED, resistor, etc), PTF ink land (typically silver), conductive adhesive (typically silver), staking compound (non-conductive), and encapsulant (non-conductive).

定价： 0元 / 折扣价： 0 元