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5.1 Abrasion resistance during transport and storage is essential to prevent marring of type matter, designs, or protective coatings on the exterior of labels and other printed materials. Recognizing that the actual amount of abrasion occurring in the field depends on relative humidity, temperature, tightness of packing, and a host of other variables, this test method provides a rapid means for comparing the abrasion resistance of test surfaces under laboratory conditions. It is useful for specification acceptance between the supplier and the customer.5.2 This test method can also be used to evaluate the relative abrasion resistance of printed inks, varnishes, laminates and substrates, and the abrasiveness of inks.1.1 This test method covers the procedure for determining the abrasion resistance of printed matter using a GA-CAT Comprehensive Abrasion Tester.1.2 This test method is applicable to packaging labels, book, catalog, and magazine covers, bar codes, corrugated boxes, and other containers having applied graphics on any flat substrate. It is not recommended for powder coatings.1.3 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.1.5 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

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6.1 One of the key properties for printing in the lab or on production equipment is the intensity of the color, color balance and uniformity. This test can be used to ensure that the proper amount of ink is transferred to the substrate by obtaining a target density value, in addition to determining whether the print is uniform by measuring the reflection density over a wide print area. This then allows the use of the print for controlled testing of other appearance properties, such as gloss and color, and performance properties, such as resistance to abrasion and chemicals.6.2 This test can be used to help achieve consistent color reproduction of printed color on flat surfaces.6.3 Transfer of density readings from one set of inks to another, or from one substrate to another, carries a high risk of producing a color or tone shift. It is not in the scope of this test method to use density readings as digital proof of target points for printing process control.1.1 This test method describes a procedure for measuring reflection density of printed matter using a reflection densitometer or spectrodensitometer.1.2 This test method is intended primarily for process colors (yellow, magenta and cyan) and black. With appropriate instrumentation, it may also be used for other colors.1.3 This test method applies to prints made by any printing process on a flat surface, with reflection density values ranging from just above zero, on the unprinted substrate, through to around 2.5 for very dense prints.1.4 This test method can be used for prints on paper, film or board but not for those on metal or foil. It can be conducted in the pressroom or laboratory.1.5 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.1.6 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.1.7 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

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4.1 Dielectric withstand voltage testing is useful for design verification, quality control of materials, and workmanship.4.2 This test method is used to verify that the membrane switch or printed electronic device can operate safely at its rated voltage, and withstand momentary overpotentials due to switching, surges and other similar electrical phenomena.4.3 Specific areas of testing are, but not limited to:4.3.1 Conductor/dielectric/conductor crossing point,4.3.2 Close proximity of conductors, and4.3.3 Any other conductive surface such as shielding or metal backing panel.4.4 Dielectric withstand voltage testing may be destructive and units that have been tested should be considered unreliable for future use.4.5 Testing using ac voltage may be useful for switches intended for control circuits powered by ac voltages.1.1 This test method covers the verification of a specified dielectric withstand voltage or dielectric breakdown voltage of a membrane switch or printed electronic device.

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3.1 Capacitance testing is useful for design verification, quality control of materials, and workmanship.3.2 High capacitance may interfere with the reliable performance of interface electronics.3.3 Specific areas of testing are, but not limited to:3.3.1 Conductor/dielectric/conductor crossing point,3.3.2 Close proximity of conductors, and3.3.3 Any other conductive surface such as shielding or metal backing panel.1.1 This test method covers the determination of capacitance(s) of a membrane switch or printed electronic device.1.2 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

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3.1 Packaging materials may be exposed to chemicals such as water, alcohol, acid, etc. during their life cycle. If it is anticipated that the packaging material will be exposed to a chemical, it is important that the ink or coating, or both, not degrade, soften, or dissolve as a result of that contact.3.2 The testing included in this practice is applicable to surface printed and coated materials designed to be resistant to a specific chemical.3.3 The chemicals to be tested should be compatible with (that is, not damage or degrade) the substrate being printed or coated, or both.3.4 There are four separate methods detailed in this practice. The methods represent increasing degrees of severity from Method A to Method D. Selection of method should be based on the type of exposure anticipated. For example, the pouring method (Method A) is typically used where incidental exposure is anticipated, such as a spill or splash of chemical on the material surface. Method B or C is typically used when chemical resistance is desired depending on the level of exposure (B) and abrasion (C) anticipated. Method D would represent continual contact between the chemical and material and would need to be chemical-proof, (for example, if the package were to be submerged in the chemical and exposed to abrasion over a period of time.)3.5 This practice does not address acceptability criteria. These need to be jointly determined by the user and producer of the product, based on the type of exposure that is anticipated.1.1 This practice describes the procedure for evaluating the ability of an ink, overprint varnish or coating to withstand chemical exposure. Typical chemicals, which may come in contact with the package, include water, alcohol, acid, etc. The specific chemical and method of choice as well as determination of measurement outcome are left to users to agree upon in joint discussion. Suggestions for ways to measure and collect information are offered in the various methods listed in this practice.1.2 The values stated in either SI units or inch-pound units are to be regarded separately as standard. The values stated in each system may not be exact equivalents; therefore, each system shall be used independently of the other. Combining values from the two systems may result in non-conformance with the standard.1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.1.4 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

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5.1 This test method provides a way to detect contamination on printed wiring board fingers that affects the electrical performance of such fingers. Such contamination may arise during PWB manufacture, circuit assembly, or service life and may include solder mask, solder flux, hardened lubricants, dust, or other materials. This test method provides a nondestructive method of inspecting such fingers at any point in the life of the product including after original manufacture, after assembly of circuit components to the PWB, and after time in service such as when returned for repair. Because this test method uses two probes to finger contacts in series, it provides a sensitive test for contaminants that may increase electrical resistance when the fingers are plugged into an edgecard connector that typically makes contact to the finger through only one contact to finger interface.5.2 Practice B667 describes a more general procedure for measuring contact resistance of any solid material in practically any geometrical form. The method in Practice B667 should be used for general studies and fundamental studies of electrical contact materials.1.1 This test method defines a resistance probing test for detecting the presence of foreign matter on Printed Wiring Board (PWB) contacts or fingers that adversely affects electrical performance. This test method is defined specifically for such fingers coated with gold. Application of this test method to other types of electrical contacts or to fingers coated with other materials may be possible and desirable but may require some changes in fixturing, procedures, or failure criteria.1.2 Practice B667 describes another contact resistance probe method that has more general application to electrical contacts of various materials and shapes. Practice B667 should be used for more fundamental studies. This test method provides a fast inspection method for printed wiring board fingers.1.3 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to become familiar will all hazards including those identified in the appropriate Material Safety Data Sheet (MSDS) for this product/material as provided by the manufacturer, to establish appropriate safety, health, and environmental practices, and determine the applicability of regulatory limitations prior to use.1.5 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

定价: 515元 / 折扣价: 438 加购物车

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5.1 Abrasion resistance is a desirable and sometimes critical property of printed materials. Abrasion damage can occur during shipment, storage, handling, and end use. The result is a significant decrease in product appearance and legibility of product information. The amount of abrasion damage to a printed substrate is dependent on shipping conditions, possibly temperature and humidity, time, and many other variables. This practice provides a way of comparing abrasion resistance of printed materials under laboratory conditions.5.2 This practice also can be used to evaluate the relative abrasion resistance of printed inks, coatings, laminates, and substrates.5.3 This practice can be modified to measure the effects of the product (detergent powder, food, beverages, etc.) on abrasion resistance, as may occur in spillage or leakage in transit.5.4 This practice can provide a reasonably simple procedure that can be used by both the buyer and the seller of printed materials to determine if the product offered for sale meets some predetermined standard for abrasion or scuff resistance.1.1 This practice covers a procedure for determining the abrasion resistance of printed materials using the Sutherland Rub Tester, or its equivalent, equipped with full-width rubber pads and using standardized receptors.1.2 This practice is applicable to labels, folding cartons, corrugated boxes, inserts, circulars, and other packaging materials having applied graphics on a flat substrate.1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.1.4 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

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This specification provides a standard means for testing and measuring the performance characteristics of printed, pressure-sensitive adhesive labels for containers, particularly containers to be used in extreme distribution environments (for example, hazardous materials labels, aerospace, military containers). For the purposes of this specification, an extreme distribution environment is one in which it can be reasonably expected to experience direct exposure to deteriorating chemicals, weather, elevated/cold temperatures, and other environmental and physical elements for an extended period of time. This specification includes standard laboratory test methods to simulate exposure to various conditions and measure associated degradation of required performance characteristics. The data from these methods can be used as acceptance criteria between a supplier and customer. This specification covers the physical properties of the labels, as well as workmanship, finish and appearance, acceptance criteria, testing procedures, reporting of all the steps taken, certification, and preparation for delivery.1.1 This specification provides a standard means to test and measure performance characteristics of printed, pressure-sensitive adhesive labels for containers, particularly containers to be used in extreme distribution environments (for example, hazardous materials labels, aerospace, military containers). For the purposes of this specification, an extreme distribution environment is one in which it can be reasonably expected to experience direct exposure to deteriorating chemicals, weather, elevated/cold temperatures, and other environmental and physical elements for an extended period of time.1.2 Units—The values stated in either SI units or inch-pound units are to be regarded separately as standard. The values stated in each system may not be exact equivalents; therefore, each system shall be used independently of the other. Combining values from the two systems may result in non-conformance with the standard.1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.1.4 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

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AS 1521-1976 Grid system for printed circuits 被代替 发布日期 :  1970-01-01 实施日期 : 

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ASTM D7163-11 Standard Test Method for Specular Gloss of Printed Matter (Withdrawn 2020) Withdrawn, No replacement 发布日期 :  1970-01-01 实施日期 : 

Specular gloss is a very important appearance parameter of printed matter. High gloss may be preferred for some purposes such as magazine covers, packaging and advertising, while lower gloss is preferred for minimizing glare, for example, in reading text. This method provides a means of determining gloss of prints produced in the laboratory, or to monitor print gloss on a production printing press.1.1 This test method covers the procedure for determining the specular gloss of printed matter. 1.2 This test is applicable to prints on any flat substrate including paper, paperboard, metallic foil and plastic produced by any printing process, either in the laboratory or on a production printing press. 1.3 This standard does not purport to address all of the safety concerns, is any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and to determine the applicability of regulatory limitations prior to use.

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5.1 Membrane switches or printed electronic devices are tested for function and aesthetically inspected by the manufacturer before release to the end user. The user can unknowingly damage the device beyond repair prior to, or during, the application (laminating) process.5.2 Awareness and proper techniques are essential to the end user and this guide should be noted on all drawings, quality control documentation, and assembly instructions. Proper training and practice must be provided to work area supervisors and their staff.5.3 Concerning materials choice, consistency, and design in use, it is important to know what to look for and how to design for durability and to test for or prevent potential failures, or both.5.4 Component failure due to handling damage is one of the most common causes of customer complaints. It is the end user’s responsibility to ensure that the product is not damaged during installation5.5 In the event of component failures a comparison of pre- and post-assembly test performance may help determine the cause of failure. Even if an acceptable change is noted, it may be the result of the unit being over stressed and the application process should be reviewed and changed if necessary. It is important to determine if the change or failure is one that should have withstood the application process, or whether the application process is causing undue stress. Bend, Crease, and Mandrel Testing in accordance with Test Methods F2749, F2750, and F3147 may be necessary to determine the root cause and location of failure.1.1 This guide covers proper handling and application of a flexible circuit membrane switch, or printed electronic assembly to its final support structure to avoid mechanical or electrical failure.1.2 Damage of internal tactile devices or surface mount device (SMD) components can occur with excessive flexing or bending during lamination, repositioning, from uneven support surface, air entrapment, or pressing keys when unsupported.1.3 Design considerations and material selection can impact the membrane switch or the printed electronic device’s ability to endure the mechanical stress that can occur in handling, application and use. These should be considered as early as possible in the design phase.1.4 Recent advancements in printed electronic polymer materials have shown increased reliability from flexing and creasing, replacing copper flex circuits in many cases.1.5 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

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This specification covers twelve grades of thermosetting laminate with copper foil cladded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards. The laminates shall meet the following requirements: peel strength after solder float and at elevated temperature conditions; lengthwise and crosswise flexural strengths; flammability rating; water absorption; volume resistivity; dielectric breakdown parallel to laminations; dissipation factor; and permittivity. Warp or twist, and blistering requirements shall also be tested for conformance.1.1 This specification covers twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards.1.2 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

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3.1 Nearly all electronic devices are susceptible to possible damage or degradation from ESD encountered in their operating environments. The sensitivity of the equipment, the potential consequences of a malfunction, and the expected environmental conditions all impact the level of ESD protection needed.3.2 ESD shielding effectiveness test may be destructive, and units that have been tested should be considered unreliable for future use.1.1 This test method is used to determine the electrostatic discharge (ESD) shielding effectiveness of a membrane switch assembly or printed electronic device. This test method may be used to test a membrane switch or printed electronic device to destruction, that is, to determine its maximum ESD shielding effectiveness, or it may be used to test the ability of a membrane switch or printed electronic device to withstand a predetermined level of exposure.1.2 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use..

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3.1 Creasing of membrane switches, printed electronic device, or their components can affect their visual appearance, mechanical integrity or electrical functionality. This practice simulates conditions that may be seen during manufacture, installation or use.3.2 Crease testing may be destructive, therefore any samples tested should be considered unfit for future use.3.3 Specific areas of testing include, but are not limited to:3.3.1 Membrane switch flex tails or printed electronic device, and3.3.2 Any component of a membrane switch or printed electronic device that may be subjected to creasing.1.1 This test method establishes a method for the creasing of any part of a membrane switch or printed electronic device with conductive circuits.1.1.1 The values given in SI units are to be regarded as the standard. The values given in parentheses are for information only.1.2 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

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3.1 Bending of membrane switches, printed electronic device or their components can affect their visual appearance, mechanical integrity or electrical functionality. This test method simulates conditions that may be seen during manufacture, installation or use.3.2 Bend testing may be destructive, therefore any samples tested should be considered unfit for future use.3.3 Specific areas of testing include, but are not limited to:3.3.1 Membrane switch flex tails or printed electronic device, and3.3.2 Any component of a membrane switch or printed electronic device that may be subjected to bending.1.1 This test method establishes a method for the bending of any part of a membrane switch or printed electronic device with conductive circuits.1.1.1 The values given in SI units are to be regarded as the standard. The values given in parentheses are for information only.1.2 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

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