印制电路和其它内连接结构用材料 第4-18部分：不覆铜的预浸料系列分规范 多层印制电路板无铅装联用限定燃烧性（垂直燃烧）的E玻璃纤维布增强高性能环氧粘结片

Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) –High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly