- 您的位置:
- 中国标准在线服务网 >>
- 全部标准分类 >>
- 国际标准 >>
- 31.190;19.040 >>
- IEC TR 60068-3-15:2024 EN 51539c65
【国际标准】 Environmental testing - Part 3-15: Supporting documentation and guidance - Vacuum-assisted reflow soldering
本网站 发布时间:
2024-05-13
开通会员免费在线看70000余条国内标准,赠送文本下载次数,单本最低仅合13.3元!还可享标准出版进度查询、定制跟踪推送、标准查新等超多特权!  
查看详情>>
标准简介
适用范围:
暂无
标准号:
IEC TR 60068-3-15:2024 EN
标准名称:
Environmental testing - Part 3-15: Supporting documentation and guidance - Vacuum-assisted reflow soldering
英文名称:
Environmental testing - Part 3-15: Supporting documentation and guidance - Vacuum-assisted reflow soldering标准状态:
现行-
发布日期:
2024-02-06 -
实施日期:
出版语种:
EN
- 其它标准
- 上一篇: IEC 60335-2-31:2012+AMD1:2016+AMD2:2018 CSV EN-FR 6a10a8d2 Household and similar electrical appliances - Safety - Part 2-31: Particular requirements for range hoods and other cooking fume extractors
- 下一篇: IEC 60335-2-31-EXV-CMV:2024 EN b29e6e28 Household and similar electrical appliances - Safety - Part 2-31: Particular requirements for range hoods and other cooking fume extractors
- 推荐标准
- 国家标准计划
- IEC TR 60068-3-15:2024 EN 51539c65 Environmental testing - Part 3-15: Supporting documentation and guidance - Vacuum-assisted reflow soldering
- IEC TR 60068-3-12:2022 EN 12885fc6 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
- IEC 60068-2-21:2021 EN-FR b3ee043d Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
- IEC 60068-2-69:2017/AMD1:2019 EN-FR aaf4811a Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
- IEC 60068-2-69:2017+AMD1:2019 CSV EN-FR fb31dcb9 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
- IEC 60068-2-58:2015/AMD1:2017 EN e0294541 Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-58:2015/AMD1:2017 EN-FR bc0319db Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-58:2015+AMD1:2017 CSV EN-FR 8c846066 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-58:2015+AMD1:2017 CSV EN 0a662ce2 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-69:2017 EN-FR a9265d4a Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
- IEC 60068-2-58:2015 EN-FR 6e136996 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-83:2011 EN-FR a301c460 Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
- IEC 60068-2-69:2007 EN_D 6449313e Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
- IEC 60068-2-69:2007 EN-FR 922ec2ab Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
- IEC 60068-2-21:2006 EN_D b8a6e6e5 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices