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IEC 60749-34:2010 EN-FR
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
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发布日期 :
2010-10-28
实施日期 :
IEC 61249-2-34:2009 EN-FR
Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad
现行
发布日期 :
2009-02-11
实施日期 :
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