IEC 61189-5-4:2015 EN-FR a64b8d2d
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
现行
发布日期 :
2015-01-08
实施日期 :
IEC 61189-5-601:2021 EN-FR 0564fa4c
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
现行
发布日期 :
2021-02-03
实施日期 :
IEC 61249-2-10:2003 EN-FR 044dbc33
Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
现行
发布日期 :
2003-02-27
实施日期 :
IEC 61249-2-11:2003 EN-FR e52581ae
Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
现行
发布日期 :
2003-11-12
实施日期 :