IEC 61249-4-14:2009 EN_D c0cf6b13
Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
现行
发布日期 :
2009-05-26
实施日期 :
IEC 61249-4-16:2009 EN-FR 920bf542
Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
现行
发布日期 :
2009-05-26
实施日期 :
IEC 61249-4-18:2013 EN-FR 5d55286b
Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
现行
发布日期 :
2013-11-04
实施日期 :
IEC 61249-4-19:2013 EN-FR d81b9dc7
Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
现行
发布日期 :
2013-11-04
实施日期 :
IEC 62899-201:2016+AMD1:2018 CSV EN b38108a1
Printed electronics - Part 201: Materials - Substrates
现行
发布日期 :
2018-11-15
实施日期 :