IEC 61249-4-17:2009 EN_D 0639b614
Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
现行
发布日期 :
2009-05-26
实施日期 :
IEC 62326-1:2002 EN-FR dae75a8e
Printed boards - Part 1: Generic specification
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发布日期 :
2002-03-05
实施日期 :
IEC 62326-20:2016 EN-FR 1959e6ee
Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
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发布日期 :
2016-02-03
实施日期 :
IEC 62496-1:2008 EN-FR 4c58f78d
Optical circuit boards - Part 1: General
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发布日期 :
2008-12-09
实施日期 :
IEC 62899-201:2016 EN e5442686
Printed electronics - Part 201: Materials - Substrates
现行
发布日期 :
2016-02-25
实施日期 :
IEC 62899-201:2016/AMD1:2018 EN e3c32a19
Amendment 1 - Printed electronics - Part 201: Materials - Substrates
现行
发布日期 :
2018-11-15
实施日期 :