This specification covers electronic grade alloys of copper and nickel in wrought forms suitable for external and internal use in electron devices. The alloy shall be free from directional properties and shall be handled in such a manner that oxide contamination is minimized. The material shall conform to the chemical composition requirements which include nickel, cobalt, iron, zinc, manganese, lead, carbon, silicon, sulfur, aluminum, phosphorus, and copper contents. Grain size, mechanical properties, and magnetic permeability shall conform to the requirements of this specification. The alloys shall be tested for macroscopical and microscopical examinations. Packaging and marking shall be in accordance to this specification.1.1 This specification covers alloys of copper and nickel in a variety of wrought shapes suitable for external and internal use in electron devices.1.2 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.1.3 The following safety hazards caveat applies to Test Methods Section 8 only: This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.1.4 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

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3.1 This specification is intended as a reference to the performance and safety of rubber surgical drainage tubes. The safe and proper use of rubber surgical drainage tubes is beyond the scope of this standard.AbstractThis specification covers Penrose-type rubber tubes used in performing certain surgical drainage procedures. The sterility, safety, and X-ray opaque of the rubber tube shall be tested to meet the requirements prescribed. The physical dimensions and physical requirements of the rubber tube shall be tested to meet the requirements prescribed.1.1 This specification covers Penrose-type rubber tubes used in performing certain surgical drainage procedures.1.2 The specification provides for packaged sterile rubber tubes and packaged or bulk nonsterile rubber tubes.1.3 This standard does not purport to address all of the safety problems, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.1.4 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

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1.1 This practice covers the writing of specifications for thick-film pastes for electronics.1.2 The practice provides a guide for the routine procedure to be followed in specifying for procurement thick-film pastes for use in manufactured circuits. Specific requirements, intended applications, and test methods should be included or identified in each paste specification. In addition, each specification should include basic information to facilitate procurement, preparation, quality control, lot shipment identifications, and shipping of such pastes.1.3 The practice covers the development of specifications for fireable, thick-film pastes, including resistor, conductor, dielectric, and overglaze pastes.

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2.1 Molybdenum is used in engineering applications where strength and rigidity of component parts are needed, especially at high temperatures. Its good strength at high temperatures, low vapor pressure, and good impact and creep resistance make it attractive for load-bearing items such as turbine blades, mechanical seals, rocket motor parts, heating elements, and electronic devices. Molybdenum, however, is easily oxidized, and the oxides are not protective. The volatility of the oxides above 800 °C can lead, in the case of unprotected parts, to catastrophic oxidation and to losses in dimensions. Electroplated coatings are applied to molybdenum to prevent oxidation, to prevent seizing and galling, and to assist joining by soldering, brazing, and diffusion bonding.1.1 This practice covers a procedure for preparing molybdenum and its alloys for electroplating. The procedure utilizes techniques, equipment, and chemicals that are common to electroplating. Specialized procedures such as hydrogen heat treatment and fused salt pickling are not included. These and other procedures can be found in the references listed at the end of this practice.1.2 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.1.3 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

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The efficiency of light-emitting diodes is known to vary with the carrier density of the starting material. This procedure provides a technique to prepare specimens in which the Hall carrier density can be measured in a region typical of that in which devices are fabricated. This quantity, which is related to the carrier density, can be used directly as a quality control parameter.Mobility is a function of a number of parameters of a semiconductor, including ionized impurity density, compensation, and lattice defects, some or all of which may be relatable to material quality as reflected in device quality. Use of this procedure makes the measurement of the mobility of the constant composition region possible.Since in GaAs (1−x)Px with x near 0.38, as is most often used for light-emitting diodes, the direct (000 or Γ) minimum and the indirect (100 or X) minima are within a few millielectronvolts in energy of each other, both are populated with current-carrying electrons. The mobility in the two bands is significantly different, and the relative population of the two is dependent upon the precise composition (x value), doping level, and temperature. Therefore, both Hall coefficient and Hall mobility must be interpreted with care (2,3). In particular, a measurement of Hall carrier density will not agree with a carrier density measurement on the same specimen made by capacitance-voltage techniques. Nevertheless, if the intent of measuring the carrier density of purchased or grown specimens is to find those which are optimum for diode fabrication, Hall measurements can be of value because a curve of efficiency versus Hall carrier density can be derived for the device process to be used based upon data taken on specimens prepared in accordance with this procedure.1.1 This practice covers a procedure to be followed to free the constant composition region of epitaxially grown gallium arsenide phosphide, GaAs(1x)Px, from the substrate and graded region on which it was grown in order to measure the electrical properties of only the constant composition region, which is typically 30 to 100 m thick. It also sets forth two alternative procedures to be followed to make electrical contact to the specimen.1.2 It is intended that this practice be used in conjunction with Test Methods F 76.1.3 The specific parameters set forth in this recommended practice are appropriate for GaAs0. 62P0. 38, but they can be applied, with changes in etch times, to material with other compositions.1.4 This practice does not deal with making or interpreting the Hall measurement on a specimen prepared as described herein, other than to point out the existence and possible effects due to the distribution of the free carriers among the two conduction band minima.1.5 This practice can also be followed in the preparation of specimens of the constant composition region for light absorption measurements or for mass or emission spectrometric analysis.1.6 This practice becomes increasingly difficult to apply as specimens become thinner.1.7 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For hazard statement, see Section 9 and 11.9.2.4.

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1.1 This specification covers the screw to be used in the test described in Specification F474. Because of the dependence of the test results on screw dimensions, a standard test screw is needed to obtain reproducible numbers.

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1.1 This specification covers the white pigments that consist substantially of anhydrous (calcined) natural aluminum silicates (of the 1+1 layer type) and are restricted to those minerals which conform to the chemical compositional limits prescribed herein and which can be suitably processed to what is known as paint pigment quality.

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1.1 This specification applies to air ventilating grille units for detention areas, assembled in part from materials conforming to Specifications A627, A628, and A629. 1.2 The assemblies described herein are intended to provide two types of security, designated Type A and Type B. 1.2.1 Type A -A ventilation unit, utilizing homogeneous TR steel bars for the principal security component. 1.2.2 Type B -A ventilation unit utilizing perforated tool-resisting steel plate for the principal security component. 1.3 It is presumed that equipment manufacturers will fabricate and assemble the materials so as not to impair the performance characteristics specified in the applicable material specifications. 1.4 The descriptions herein of certain assemblies are not intended to infer that other assemblies cannot be used to obtain similar results.

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