DIN EN 60191-6-22
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 47D/802/CD:2011)
废止
发布日期 :
2001-08-01
实施日期 :

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400-168-0010




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