IEC 60917-2-3:2006 EN_D 229838ec
Modular order for the development of mechanical structures for electronic equipment practices - Part 2-3: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Extended detail specification - Dimensions for subracks, chassis, backplanes, front panels and plug-in units
现行
发布日期 :
2006-05-09
实施日期 :
IEC 60191-6-17:2011 EN-FR 5d9658cd
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
现行
发布日期 :
2011-01-27
实施日期 :
IEC 63171-7:2023 EN 9c9cf3a9
Connectors for electrical and electronic equipment - Part 7: Detail specification for up to 7 ways including PE or FE (data/power) and shield pin, free and fixed circular connectors for balanced single-pair data transmission with current-carrying capacity - Mechanical mating information, pin assignment and additional requirements for type 7
现行
发布日期 :
2023-05-23
实施日期 :
IEC 60749:1996 EN-FR fcb6e313
Semiconductor devices - Mechanical and climatic test methods
被代替
发布日期 :
1996-10-28
实施日期 :
IEC TS 61400-13:2001 EN 29d30c22
Wind turbine generator systems - Part 13: Measurement of mechanical loads
被代替
发布日期 :
2001-06-28
实施日期 :
IEC 60749-22:2002 EN-FR 2ac58a50
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
被代替
发布日期 :
2002-09-12
实施日期 :
AS 1100.201-1992/Amdt 1-1994
Technical drawing - Mechanical engineering drawing
现行
发布日期 :
1994-07-11
实施日期 :

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