IEC 61249-2-42:2010 EN-FR 5fc5a02c
Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
现行
发布日期 :
2010-04-21
实施日期 :
IEC 61249-2-44:2016 EN-FR 6ad0b1ef
Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
现行
发布日期 :
2016-05-12
实施日期 :
IEC TR 61189-5-506:2019 EN 3059c021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
现行
发布日期 :
2019-06-26
实施日期 :
IEC 61249-2-31:2009 EN-FR 06435787
Materials for printed boards and other interconnecting structures - Part 2-31: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad
现行
发布日期 :
2009-02-11
实施日期 :