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This guide provides methods for the characterization of the shielding effectiveness of the board level shields. This document guides the user in the selection of the appropriate test method.

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This standard defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSIs are interconnected. Collectively, such designs are referred to as LSI-Package-Board (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs.

定价： 205元 / 折扣价： 175 元

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This standard defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSIs are interconnected. Collectively, such designs are referred to as LSI-Package-Board (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs.

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This document addresses the quality of measured S-parameters for electrical printed circuit board (PCB) and related interconnect at frequencies up to 50 GHz. This might include, but is not limited to: test fixtures, as well as methods and processes for controlling the accuracy and consistency of measured data for broadband signals with frequency content up to 50 GHz. The standard is applicable to: -PCB and related interconnects (including package, connector, cable, etc.) used in high speed… read more digital applications, operating with signals at frequencies up to 50 GHz. -Most industries using such interconnects; -Major measurement approaches (Time Domain or Frequency Domain) for collecting S-Parameter data; -Significant methods of removing/de-embedding fixture and instrumentation effects. read less

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