
【国外标准】 Semiconductor devices, mechanical standardization - Devices with terminals disposed in three or more rows in each orthogonal direction (IEC 47D(Sec)31:1994)
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2025-06-05
- DIN IEC 47D(Sec)31
- 废止
- 定价:
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适用范围:
暂无
标准号:
DIN IEC 47D(Sec)31
标准名称:
Semiconductor devices, mechanical standardization - Devices with terminals disposed in three or more rows in each orthogonal direction (IEC 47D(Sec)31:1994)
英文名称:
标准状态:
废止-
发布日期:
2001-02-01 -
实施日期:
出版语种:
- 其它标准
- 上一篇: DIN IEC 47D(Sec)30 Semiconductor devices, mechanical standardization - Wire-ended diode package (small signal diode), package outline A54 in IEC 191-2 (IEC 47D(Sec)30:1994)
- 下一篇: DIN IEC 47D(Sec)36 Semiconductor devices, mechanical standardization - Plastic shrink small outline package (SSOP), 5,3 mm body width, 0,65 mm pitch, 1,25 mm lead length (IEC 47D(Sec)36:1994)
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