
【国外标准】 Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) (IEC 47D/834/CD:2013)
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2025-06-05
- DIN EN 60191-6-13
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适用范围:
暂无
标准号:
DIN EN 60191-6-13
标准名称:
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) (IEC 47D/834/CD:2013)
英文名称:
标准状态:
废止-
发布日期:
2001-07-01 -
实施日期:
出版语种:
- 其它标准
- 上一篇: DIN EN 50377-4-4 Connector sets and interconnect components to be used in optical fibre communication systems - Product specifications - Part 4-4: Type SC-PC simplex terminated on IEC 60793-2-50 category B1.1, B1.3 and B6a singlemode fibre, with full zirconia ferrule Category U; German version prEN 50377-4-4:2008
- 下一篇: DIN EN 60191-6-16 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 47D/835/CD:2013)
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