购物车
400-168-0010
【国际标准】 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
本网站 发布时间：
2024-05-13
开通会员免费在线看70000余条国内标准，赠送文本下载次数，单本最低仅合13.3元！还可享标准出版进度查询、定制跟踪推送、标准查新等超多特权！
查看详情>>
标准简介适用范围：
暂无
标准号：
IEC 61191-3:2017 EN-FR
标准名称：
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
英文名称：
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies标准状态：
现行-
发布日期：
2017-05-30 -
实施日期：
出版语种：
EN-FR
- 推荐标准
- IEC TR 60286-7:2019 EN-FR 33a150be Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components
- IEC TR 60297-3-1:2023 EN 27536ee0 Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-1: Technological schemes and applications
- IEC TS 62454:2007 EN-FR ad5f4c5f Mechanical structures for electronic equipment - Design guide: Interface dimensions and provisions for water cooling of electronic equipment within cabinets of the IEC 60297 and IEC 60917 series
- IEC TS 62610-1:2009 EN 08623a3c Mechanical structures for electronic equipment - Thermal management for cabinets in accordance wit IEC 60297 and IEC 60917 series - Part 1: Design guide: Interface dimension and provision for thermoelectrical cooling systems (Peltier effect)
- IEC TS 62610-2:2011 EN-FR 65fdd7ae Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 2: Design guide: Method for determination of forced air-cooling structure
- IEC 60917-1:1998 EN-FR cdf62d13 Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard
- IEC 60917-1:1998+AMD1:2000 CSV EN-FR 2291ff9d Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard
- IEC 60917-1:2019 RLV EN f383864a Modular order for the development of mechanical structures for electrical and electronic equipment practices - Part 1: Generic standard
- IEC 60917-2-2:1994 EN-FR b55be7c3 Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Section 2: Detail specification - Dimensions for subracks, chassis, backplanes, front panels and plug-in units
- IEC 60917-2-3:2006 EN_D 229838ec Modular order for the development of mechanical structures for electronic equipment practices - Part 2-3: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Extended detail specification - Dimensions for subracks, chassis, backplanes, front panels and plug-in units
- IEC 60917-2-5:2012 EN-FR 63721ecb Modular order for the development of mechanical structures for electronic equipment practices - Part 2-5: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Cabinet interface dimensions for miscellaneous equipment
- IEC 60917-2:1992 EN-FR 8a8fb092 Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice
- IEC 61191-1:2013 EN-FR a3bbd928 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
- IEC 61191-1:2018 RLV EN f815df6e Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
- IEC 61191-2:2013 EN-FR 3eb031c4 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
