【团体标准】 半导体制冷器具技术规范

本标准规定了半导体制冷器具的总体要求、技术要求、试验方法、检验规则以及标志、包装、运输和贮存。其中，总体要求对工作环境、工作电源、热电材料以及设计、安全要求作出规定，技术要求包括外观结构、凝露、噪声、耗电量、最大制冷温差、响应时间、可靠性要求以及电磁兼容性要求，并给出了对应的试验方法。适用于半导体制冷器具的设计、生产与检验。Thisstandardspecifiesthegeneralrequirements,technicalrequirements,testmethods,inspectionrules,aswellasmarking,packaging,transportationandstorageofsemiconductorrefrigerationappliances.Amongthem,theoverallrequirementsstipulatetheworkingenvironment,workingpowersupply,thermoelectricmaterials,aswellasdesignandsafetyrequirements.Thetechnicalrequirementsincludeappearancestructure,condensation,noise,powerconsumption,maximumcoolingtemperaturedifference,responsetime,reliabilityrequirementsandelectromagneticcompatibilityrequirements,andcorrespondingtestmethodsareprovided.Itisapplicabletothedesign,productionandinspectionofsemiconductorrefrigerationappliances.