【国外标准】 Standard Specification for Integrated Circuit Lead Frame Material (Withdrawn 2023)

This specification covers the special requirements for a metal strip used in the fabrication of integrated-circuit lead frames by stamping or photochemical milling. The metal strip shall be manufactured from copper and copper alloys, ferrous alloys containing nickel, cobalt, or chromium, nickel and nickel alloys, or other metallic materials and shall conform to the chemical, physical, and mechanical property requirements specified, including the limitation on the severity and number of inclusions, the surface finish, and the coil size. Tests for straightness, flatness, coil set, and grain size shall be performed and shall conform to the requirements specified.1.1 This specification covers the special requirements for metal strip to be used to fabricate integrated-circuit lead frames by stamping or photochemical milling.1.2 The metals that are applicable to these parts include copper and copper alloys, ferrous alloys usually containing nickel or cobalt or chromium, nickel and nickel alloys, and other metallic materials.1.3 The general chemical, physical, and mechanical property requirements of these materials are covered by other ASTM specifications (specifically Specifications B103/B103M, B122/B122M, B152/B152M, B162, B465, F15, F30, F31, F49 and F68), and these should be consulted for properties and tempers that are different for the different metals. For metals for which no ASTM specification is available, other specifications should be adopted by agreement of the parties concerned.1.4 The values stated in SI units are to be regarded as standard. The values given in parentheses after SI units are provided for information only and are not considered standard.1.5 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.