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【国际标准】 Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods
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2026-01-04
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标准简介适用范围：
暂无
标准号：
IEC 60749-22-1:2025 FR
标准名称：
Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods
英文名称：
Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods标准状态：
现行-
发布日期：
2025-11-26 -
实施日期：
出版语种：
FR
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