我的标准
购物车
400-168-0010
【国际标准】 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
本网站 发布时间：
2025-01-04
开通会员免费在线看70000余条国内标准，赠送文本下载次数，单本最低仅合13.3元！还可享标准出版进度查询、定制跟踪推送、标准查新等超多特权！
查看详情>>
标准简介适用范围：
暂无
标准号：
IEC 61190-1-3:2007+AMD1:2010 CSV EN-FR
标准名称：
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
英文名称：
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications标准状态：
REVISED-
发布日期：
2010-11-10 -
实施日期：
出版语种：
EN-FR
- 其它标准
- 上一篇： IEC 61190-1-3:2007 EN_D 19ba23fb Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
- 下一篇： IEC 61190-1-3:2007/AMD1:2010 EN-FR 78299342 Amendment 1 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
- 推荐标准
- IEC TR 62878-2-8:2021 EN c105d47d Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate
- IEC TR 62878-2-9:2022 EN 25fdb326 Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries
- IEC TS 62878-2-10:2024 EN fcc8b7d1 Device embedding assembly technology - Part 2-10: Design specification for cavity substrate
- IEC TS 62878-2-1:2015 EN-FR 36cfde4e Device embedded substrate - Part 2-1: Guidelines - General description of technology
- IEC TS 62878-2-4:2015 EN-FR 40a38b25 Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
- IEC 60068-2-21:2006 EN-FR 1ca3ac76 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
- IEC 60068-2-21:2021 EN-FR b3ee043d Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
- IEC 60068-2-58:2015 EN-FR 6e136996 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-58:2015/AMD1:2017 EN e0294541 Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-83:2011 EN-FR a301c460 Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
- IEC 60194-1:2021 EN-FR 29bbb2da Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies
- IEC 60194-2:2017 EN aaacd466 Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies
- IEC 60194:2006 EN 28f872b6 Printed board design, manufacture and assembly - Terms and definitions
- IEC 61188-5-2:2003 EN-FR 07a27db2 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
- IEC 61188-5-6:2003 EN-FR 39035a29 Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
