
【国外标准】 Testing methods for resistance of adhesive bonds to water or moisture
本网站 发布时间:
2024-10-15
开通会员免费在线看70000余条国内标准,赠送文本下载次数,单本最低仅合13.3元!还可享标准出版进度查询、定制跟踪推送、标准查新等超多特权!  
查看详情>>

适用范围:
暂无
标准号:
JIS K 6857:1973
标准名称:
Testing methods for resistance of adhesive bonds to water or moisture
英文名称:
Testing methods for resistance of adhesive bonds to water or moisture标准状态:
现行-
发布日期:
1973-09-01 -
实施日期:
出版语种:
- 推荐标准
- AS 1180 (Pt 9A to 9C)-1973 Methods of test for hose made from elastomeric materials - Third Group Methods 9A, 9B, 9C
- AS 1220.1-1973 Aluminium conductors steel reinforced for overhead power transmission purposes Galvanized steel reinforced (ACSR/GZ)
- AS 1368-1973 Method for the determination of the Vicat softening point of thermoplastic materials
- AS 1371-1973 Toilet seats of moulded plastics
- AS 1528.1-1973 Tubes (stainless steel) and tube fittings for the food industry Tubes
- ASTM F1973-21 Standard Specification for Factory Assembled Anodeless Risers and Transition Fittings in Polyethylene (PE) and Polyamide 11 (PA11) and Polyamide 12 (PA12) Fuel Gas Distribution Systems
- AS K152.12-1965 Methods for the analysis and testing oc coal and coke Caking and swelling properties of coal
- AS 1973-1993 Pneumatic tyres - Passenger car, light truck, and truck/bus - Retreading and repair processes
- JIS C 5630-12:2014 Semiconductor devices -- Micro-electromechanical devices -- Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
- JIS C 5630-13:2014 Semiconductor devices -- Micro-electromechanical devices -- Part 13: Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
- JIS C 5630-18:2014 Semiconductor devices -- Micro-electromechanical devices -- Part 18: Bend testing methods of thin film materials
- JIS C 5630-19:2014 Semiconductor devices -- Micro-electromechanical devices -- Part 19: Electronic compasses
- JIS C 5630-20:2015 Semiconductor devices -- Micro-electromechanical devices -- Part 20: Gyroscopes
- JIS C 5630-28:2020 Semiconductor devices -- Micro-electromechanical devices -- Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices
- JIS C 5630-2:2009 Semiconductor devices -- Micro-electromechanical devices-- Part 2: Tensile testing method of thin film materials