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- IEC 60191-6-12:2011 EN-FR bfa31d12 Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
【国际标准】 Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
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标准简介适用范围：
暂无
标准号：
IEC 60191-6-12:2011 EN-FR
标准名称：
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
英文名称：
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)标准状态：
现行-
发布日期：
2011-06-08 -
实施日期：
出版语种：
EN-FR
- 其它标准
- 上一篇： IEC 60191-6-10:2003 EN_D 54edb3b9 Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
- 下一篇： IEC 60191-6-13:2007 EN-FR cfff1f84 Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
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