
【国外标准】 Environmental testing -- Part 2: Tests -- Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
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适用范围:
暂无
标准号:
JIS C 60068-2-58:2006
标准名称:
Environmental testing -- Part 2: Tests -- Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
英文名称:
Environmental testing -- Part 2: Tests -- Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)标准状态:
被代替-
发布日期:
1994-04-01 -
实施日期:
出版语种:
- 其它标准
- 上一篇: JIS C 60068-2-58:2002e Environmental testing -- Part 2: Tests -- Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- 下一篇: JIS C 60068-2-58:2016 Environmental testing -- Part 2-58: Tests -- Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
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