
【国外标准】 Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (IEC 47F/178/CD:2013)
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2025-04-30
- DIN EN 62047-26
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适用范围:
暂无
标准号:
DIN EN 62047-26
标准名称:
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (IEC 47F/178/CD:2013)
英文名称:
标准状态:
废止-
发布日期:
2001-05-01 -
实施日期:
出版语种:
- 其它标准
- 上一篇: DIN EN 62047-25 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 47F/183/CD:2014)
- 下一篇: DIN EN 62343-5-1 Dynamic modules - Part 5-1 Test methods - Dynamic gain tilt equalizer - Gain tilt settling time measurement (IEC 86C/1199/CD:2013)
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