
【国外标准】 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods (IEC 47F/125/CD:2012)
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2025-04-30
- DIN EN 62047-16
- 废止
- 定价: 441元
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适用范围:
暂无
标准号:
DIN EN 62047-16
标准名称:
Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods (IEC 47F/125/CD:2012)
英文名称:
标准状态:
废止-
发布日期:
2001-11-01 -
实施日期:
出版语种:
- 其它标准
- 上一篇: DIN EN 62047-15 Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding quality between PDMS and glass (IEC 47F/126/CD:2012)
- 下一篇: DIN EN 62047-21 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials (IEC 47F/127/CD:2012)
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