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- DIN EN IEC 61189-2-809 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA (IEC 91/1747/CD:2021); Text in German and English

【国外标准】 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA (IEC 91/1747/CD:2021); Text in German and English
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- DIN EN IEC 61189-2-809
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标准号:
DIN EN IEC 61189-2-809
标准名称:
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA (IEC 91/1747/CD:2021); Text in German and English
英文名称:
标准状态:
现行-
发布日期:
2001-03-01 -
实施日期:
出版语种:
- 其它标准
- 上一篇: DIN EN IEC 61189-2-808 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of dielectric layer by thermal transient method (IEC 91/1690/CD:2020); Text in German and English
- 下一篇: DIN EN IEC 61757-3-2 Fibre Optic Sensors - Part 3-2: Acoustic sensing - Distributed sensing (IEC 86C/1675/CD:2020); Text in German und English
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