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【国际标准】 Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points
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2026-02-25
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标准简介适用范围：
暂无
标准号：
IEC 63378-6:2026 EN-FR
标准名称：
Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points
英文名称：
Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points标准状态：
现行-
发布日期：
2026-02-04 -
实施日期：
出版语种：
EN-FR
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