【国外标准】 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 47/2016/CDV:2009); German version EN 60749-19:2003/FprA1:2009
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适用范围:
暂无
标准号:
DIN EN 60749-19/A1
标准名称:
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 47/2016/CDV:2009); German version EN 60749-19:2003/FprA1:2009
英文名称:
标准状态:
废止-
发布日期:
2001-10-01 -
实施日期:
出版语种:
英语
- 其它标准
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- 下一篇: DIN EN 60749-21 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 47/2025/CDV:2009); German version FprEN 60749-21:2009
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