【国外标准】 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards (IEC 91/1518/CD:2018); Text in German and English

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标准简介

暂无

标准号：
DIN EN 61189-5-601
标准名称：
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards (IEC 91/1518/CD:2018); Text in German and English
英文名称：
标准状态：
现行
发布日期：
2001-11-01
实施日期：
出版语种：

DIN EN 61189-5-601