
【国际标准】 Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis
本网站 发布时间:
2025-08-20
开通会员免费在线看70000余条国内标准,赠送文本下载次数,单本最低仅合13.3元!还可享标准出版进度查询、定制跟踪推送、标准查新等超多特权!  
查看详情>>

适用范围:
暂无
标准号:
IEC 63378-3:2025 EN-FR
标准名称:
Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis
英文名称:
Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis标准状态:
现行-
发布日期:
2025-05-06 -
实施日期:
出版语种:
EN-FR
- 推荐标准
- IEC 60191-2:1966/AMD16:2007 EN-FR 294cf984 Amendment 16 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
- IEC 60191-2:1966/AMD4:2001 EN-FR 9bdd1d4f Amendment 4 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
- IEC 60191-6-16:2007 EN_D a6518e25 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
- IEC 60191-6-21:2010 EN-FR 10976b2e Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
- IEC 60747-16-2:2001/AMD1:2007 EN 7f58246f Amendment 1 - Semiconductor devices - Part 16-2: Microwave integrated circuits - Frequency prescalers
- IEC 60747-18-2:2020 EN bc5dbdc4 Semiconductor devices - Part 18-2: Semiconductor bio sensors - Evaluation process of lens-free CMOS photonic array sensor package modules
- IEC 60749-15:2020 RLV EN 3faac137 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
- IEC 60749-20:2020 EN-FR 13d6866d Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- IEC 60749-37:2022 EN-FR c791c082 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
- IEC 60749-3:2002 EN-FR e8a48067 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection
- IEC 63287-2:2023 EN-FR 916edf73 Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile
- IEC 60191-2:1966/AMD13:2006 EN-FR 1dc684b3 Amendment 13 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
- IEC 60191-6-4:2003 EN_D 83265c8e Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
- IEC 60747-14-5:2010 EN-FR cfcb0b22 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
- IEC 60749-12:2017 EN-FR 48ffb3f3 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency