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- IEC 60191-6-4:2003 EN_D 83265c8e Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
【国际标准】 Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
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标准简介适用范围：
暂无
标准号：
IEC 60191-6-4:2003 EN_D
标准名称：
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
英文名称：
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)标准状态：
现行-
发布日期：
2003-06-11 -
实施日期：
出版语种：
EN_D
- 其它标准
- 上一篇： IEC 60191-6-4:2003 EN-FR 31ef1575 Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
- 下一篇： IEC 60191-6-5:2001 EN a9ab4fcc Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
- 推荐标准
- IEC 60191-2:1966/AMD1:2001 EN-FR e7342bc0 Amendment 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
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- IEC 60191-4:2013+AMD1:2018 CSV EN-FR 375bf969 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
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