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- IEC 61191-1:2018 RLV EN f815df6e
【国际标准】 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
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标准简介
适用范围:
暂无
标准号:
IEC 61191-1:2018 RLV EN
标准名称:
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
英文名称:
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies标准状态:
现行-
发布日期:
2018-09-14 -
实施日期:
出版语种:
EN
- 其它标准
- 上一篇: IEC 61249-2-30:2012 EN-FR 84c1b1ee Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
- 下一篇: IEC 60245-8:1998/AMD1:2003 EN-FR cb210d9a Amendment 1 - Rubber insulated cables - Rated voltages up to and including 450/750 V - Part 8: Cords for applications requiring high flexibility
- 推荐标准
- 国家标准计划
- IEC 61191-1:2018 RLV EN f815df6e Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
- IEC 61191-1:2018 EN-FR a4de4501 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
- IEC 61191-2:2017 EN 1cf8856c Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
- IEC 61191-2:2017 EN-FR b075e051 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
- IEC 62739-3:2017 EN e0ccebc4 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
- IEC 62739-3:2017 EN-FR c3a403ca Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
- IEC 62739-2:2016 EN-FR 1de086e9 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
- IEC 62739-1:2013 EN-FR e120ae63 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
- IEC 61191-2:2013 EN-FR 3eb031c4 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
- IEC 61191-1:2013 EN-FR a3bbd928 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies