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- IEC TR 61760-3-1:2022 EN 44f64968 Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method
【国际标准】 Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method
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标准简介适用范围：
暂无
标准号：
IEC TR 61760-3-1:2022 EN
标准名称：
Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method
英文名称：
Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method标准状态：
现行-
发布日期：
2022-06-17 -
实施日期：
出版语种：
EN
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