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IEC 62047-19:2013 EN-FR
Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
现行
发布日期 :
2013-07-17
实施日期 :
IEC 60747-19-1:2019 EN
Semiconductor devices – Part 19-1: Smart sensors – Control scheme of smart sensors
现行
发布日期 :
2019-11-22
实施日期 :
IEC 60749-19:2003 EN-FR
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
现行
发布日期 :
2003-02-13
实施日期 :
IEC TS 60825-19:2024 EN
Safety of laser products - Part 19: Moving platform laser products
现行
发布日期 :
2024-03-06
实施日期 :
IEC 60249-2-19:1992 EN-FR
Base materials for printed circuits - Part 2: Specifications - Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
被代替
发布日期 :
1992-03-31
实施日期 :
IEC 61249-4-19:2013 EN-FR
Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
现行
发布日期 :
2013-11-04
实施日期 :