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IEC 60749-21:2011 EN-FR
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
现行
发布日期 :
2011-04-07
实施日期 :
IEC 60068-2-21:2006 EN_D
Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
REVISED
发布日期 :
2006-06-22
实施日期 :
IEC 61249-2-21:2003 EN-FR
Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
现行
发布日期 :
2003-11-12
实施日期 :
IEC 60068-2-21:2006 EN-FR
Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
REVISED
发布日期 :
2006-06-22
实施日期 :