【团体标准】 医疗设备用半导体热电致冷(TEC)器件

本标准规定了医疗设备用半导体热电致冷器件的总体要求、技术要求等内容。总体要求涵盖工作环境（分低温、中温、高温器件）和产品型号（由半导体热电制冷器件符号等六部分组成）。技术要求包括外观尺寸、性能参数、引出线强度等多方面。试验方法涉及外观尺寸、性能参数等测试。还规定了检验规则（出厂检验和型式检验）以及标志、包装等内容，适用于该器件生产与检验。Thisstandardspecifiesthegeneralrequirementsandtechnicalrequirementsforsemiconductorthermoelectriccooling(TEC)devicesusedinmedicalequipment.Thegeneralrequirementscovertheworkingenvironment(dividedintolow-temperature,medium-temperature,andhigh-temperaturedevices)andproductmodels(composedofsixpartsincludingthesymbolforsemiconductorthermoelectriccoolingdevices).Technicalrequirementsincludeappearancedimensions,performanceparameters,leadwirestrength,etc.Thetestmethodsinvolvetestsonappearancedimensionsandperformanceparameters.Italsostipulatesinspectionrules(factoryinspectionandtypeinspection),aswellasmarkingandpackaging,applyingtotheproductionandinspectionofsuchdevices.