【团体标准】 光通信用微型半导体热电致冷（Micro-TEC）器件

本标准规定了光通信用微型半导体热电致冷器件的总体要求（含产品型号、环境要求）、技术要求（包括外观、内部验视、性能参数、可靠性、有害元素含量）、试验方法、检验规则（分定型检验、交收检验、例行检验）以及标志、标签、包装、运输和贮存等内容，适用于此类器件的生产与检验。其中，产品型号由8个部分组成，涵盖器件类型、结构类别等信息；技术要求对器件的尺寸、外表面、引出线等外观方面，元件完整性、焊接情况等内部验视方面，以及最大致冷功率、最大致冷温差等性能参数和可靠性、有害元素含量均有明确规定；检验规则明确了不同检验的时机、抽样方案、项目及合格判定标准等。Thisstandardstipulatesthegeneralrequirements(includingproductmodelandenvironmentalrequirements),technicalrequirements(includingappearance,internalinspection,performanceparameters,reliability,andharmfulelementcontent),testmethods,inspectionrules(typeinspection,deliveryinspection,routineinspection),andmarking,labeling,packaging,transportationandstorageofminiaturesemiconductorthermoelectriccoolingdevicesforopticalcommunications,andisapplicabletotheproductionandinspectionofsuchdevices.Amongthem,theproductmodelconsistsof8parts,coveringinformationsuchasdevicetypeandstructurecategory;Thetechnicalrequirementsclearlystipulatetheappearanceofthedevicesuchassize,outersurface,andleadwire,internalinspectionaspectssuchascomponentintegrityandsoldering,aswellasperformanceparametersandreliabilitysuchasmaximumcoolingpowerandmaximumcoolingtemperaturedifference,andthecontentofharmfulelements.Theinspectionrulesclarifythetiming,samplingscheme,itemsandqualificationcriteriafordifferentinspections.