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- DIN IEC 60191-6-15 Mechanical standardization of semiconductor devices - Part 6-15: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 47D/673/CD:2006)
【国外标准】 Mechanical standardization of semiconductor devices - Part 6-15: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 47D/673/CD:2006)
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2025-06-05
- DIN IEC 60191-6-15
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标准简介适用范围：
暂无
标准号：
DIN IEC 60191-6-15
标准名称：
Mechanical standardization of semiconductor devices - Part 6-15: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 47D/673/CD:2006)
英文名称：
标准状态：
废止-
发布日期：
2001-03-01 -
实施日期：
出版语种：
英语
- 其它标准
- 上一篇： DIN IEC 60191-6-14 Mechanical standardization of semiconductor devices - Part 6-14: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 47D/671/CD:2006)
- 下一篇： DIN IEC 60384-20-1 Fixed capacitors for use in electronic equipment - Part 20-1: Blank detail specification: Fixed metallized polyphenylene sulfide film dielectric surface mount d.c. capacitors - Assessment level EZ (IEC 40/1768/CD:2006)
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