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- DIN IEC 60191-6-14 Mechanical standardization of semiconductor devices - Part 6-14: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 47D/671/CD:2006)
【国外标准】 Mechanical standardization of semiconductor devices - Part 6-14: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 47D/671/CD:2006)
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2025-06-05
- DIN IEC 60191-6-14
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标准简介适用范围：
暂无
标准号：
DIN IEC 60191-6-14
标准名称：
Mechanical standardization of semiconductor devices - Part 6-14: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 47D/671/CD:2006)
英文名称：
标准状态：
废止-
发布日期：
2001-03-01 -
实施日期：
出版语种：
英语
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