【国外标准】 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 47/2014/CDV:2009); German version FprEN 60749-15:2009
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2025-06-05
- DIN EN 60749-15
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适用范围:
暂无
标准号:
DIN EN 60749-15
标准名称:
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 47/2014/CDV:2009); German version FprEN 60749-15:2009
英文名称:
标准状态:
废止-
发布日期:
2001-06-01 -
实施日期:
出版语种:
英语
- 其它标准
- 上一篇: DIN EN 60191-6-4 Mechanical standardization of semiconductor devices - Part 6-4: BGA (Ball Grid Array) package measuring method (IEC 47D/469/CDV:2001); German version prEN 60191-6-4:2001
- 下一篇: DIN EN 60749-16 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) test (IEC 47/1584/CDV:2001); German version prEN 60749-16:2001
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