DIN IEC 60191-6-20
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 47D/732/CD:2008)
废止
发布日期 :
2001-02-01
实施日期 :
DIN IEC 60191-6-9
Mechanical standardization of semiconductor devices - Part 6-9: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guideline of integrated circuits for Plastic Quad Flat Package (P-QFP) (IEC 47D/490/CD:2002)
废止
发布日期 :
2001-07-01
实施日期 :
DIN IEC 60747-7
Semiconductor devices - Discrete devices - Part 7: Bipolar transistors (BTRs) (IEC 47E/324/CD:2007)
废止
发布日期 :
2001-09-01
实施日期 :
DIN EN 62047-20
Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes (IEC 47F/122/CD:2012)
废止
发布日期 :
2001-07-01
实施日期 :
DIN IEC 60191-6-14
Mechanical standardization of semiconductor devices - Part 6-14: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 47D/671/CD:2006)
废止
发布日期 :
2001-03-01
实施日期 :
DIN IEC 60747-8
Semiconductor devices - Discrete devices - Part 8: Field-effect transistors (IEC 47E/320/CD:2007)
废止
发布日期 :
2001-06-01
实施日期 :