DIN IEC 60191-6-14
Mechanical standardization of semiconductor devices - Part 6-14: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 47D/671/CD:2006)
废止
发布日期 :
2001-03-01
实施日期 :
DIN IEC 60191-6-20
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 47D/732/CD:2008)
废止
发布日期 :
2001-02-01
实施日期 :
DIN EN 62769-4
Field Device Integration (FDI) - Part 4: FDI Packages (IEC 65E/262/CD:2012), Text in English
废止
发布日期 :
2001-01-01
实施日期 :
DIN EN 12102-1
Air conditioners, liquid chilling packages, heat pumps and dehumidifiers with electrically driven compressors for space heating and cooling - Measurement of airbone noise - Determination of the sound power level - Part 1: Air conditioners, liquid chilling packages, heat pumps for space heating and cooling; German and English version prEN 12102-1:2015
废止
发布日期 :
2001-01-01
实施日期 :