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定价： 156元 / 折扣价： 133 元 加购物车

5.1 Digital integrated circuits are specified to operate with their inputs and outputs in either a logical 1 or a logical 0 state. The occurrence of signals having voltage levels not meeting the specifications of either of these levels (an upset condition) may cause the generation and propagation of erroneous data in a digital system.5.2 Knowledge of the radiation dose rate that causes upset in digital integrated circuits is essential for the design, production, and maintenance of electronic systems that are required to operate in the presence of pulsed radiation environments.1.1 This test method covers the measurement of the threshold level of radiation dose rate that causes upset in digital integrated circuits only under static operating conditions. The radiation source is either a flash X-ray machine (FXR) or an electron linear accelerator (LINAC).1.2 The precision of the measurement depends on the homogeneity of the radiation field and on the precision of the radiation dosimetry and the recording instrumentation.1.3 The test may be destructive either for further tests or for purposes other than this test if the integrated circuit being tested absorbs a total radiation dose exceeding some predetermined level. Because this level depends both on the kind of integrated circuit and on the application, a specific value must be agreed upon by the parties to the test (6.8).1.4 Setup, calibration, and test circuit evaluation procedures are included in this test method.1.5 Procedures for lot qualification and sampling are not included in this test method.1.6 Because of the variability of the response of different device types, the initial dose rate and device upset conditions for any specific test is not given in this test method but must be agreed upon by the parties to the test.1.7 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.1.8 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

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5.1 There are many kinds of linear integrated circuits. Any given linear integrated circuit may be used in a variety of ways and under various operating conditions within the limits of performance specified by the manufacturer. The procedures of this practice provide a standardized way to measure the dose-rate response of a linear integrated circuit, under operating conditions similar to those of the intended application, when the circuit is exposed to pulsed ionizing radiation.5.2 Knowledge of the responses of linear integrated circuits to radiation pulses is essential for the design, production, and maintenance of electronic systems that are required to operate in the presence of pulsed radiation environments.1.1 This practice covers the measurement of the response of linear integrated circuits, under given operating conditions, to pulsed ionizing radiation. The response may be either transient or more lasting, such as latchup. The radiation source is either a flash X-ray machine (FXR) or an electron linear accelerator (LINAC).1.2 The precision of the measurement depends on the homogeneity of the radiation field and on the precision of the radiation dosimetry and the recording instrumentation.1.3 The test may be considered to be destructive either for further tests or for other purposes if the total radiation ionizing dose exceeds some predetermined level or if the part should latch up. Because this level depends both on the kind of integrated circuit and on the application, a specific value must be agreed upon by the parties to the test. (See 6.10.)1.4 Setup, calibration, and test circuit evaluation procedures are included in this practice.1.5 Procedures for lot qualification and sampling are not included in this practice.1.6 Because response varies with different device types, the dose rate range and device upset conditions for any specific test is not given in this practice but must be agreed upon by the parties to the test.1.7 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.1.8 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

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5.1 Many electronic instruments that are designed to be used with thermocouples use some method of reference junction compensation. In many industrial applications it may be impractical to use a physical ice bath as a temperature reference in a thermocouple circuit. The instrument must therefore be able to measure the temperature at the point of electrical connection of the thermocouple and either add or subtract voltage to give a corrected equivalent of what that thermocouple would indicate had there physically been 0 °C reference junctions present in the circuit. There are two types of instruments that generally apply these techniques: electronic thermometer readouts that use a thermocouple as the sensor, and calibrators designed to calibrate these digital thermometer readouts. Additionally, the probe and circuit described in this guide can be used with a voltmeter to emulate a thermometer or a voltage source to calibrate temperature-indicating instrumentation. In all cases the probe must be calibrated if traceability or an uncertainty analysis, or both, is required.1.1 This guide covers methods of calibration and use of thermocouple reference junction probes (cold junction compensation probes) in the evaluation of electronic reference junction compensation circuits. Their use with instruments that measure only voltage is also covered.1.2 The values stated in SI units are to be regarded as standard. The values given in parentheses after SI units are provided for information only and are not considered standard.1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.1.4 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

定价： 590元 / 折扣价： 502 元 加购物车

This specification covers seamless and electric-resistance-welded steel pipe used as conduit for the installation of high-pressure pipe-type electrical cables in NPS 4 to NPS 12, inclusive, with nominal (average) wall thicknesses 0.219 to 0.562 in., depending on size. The steel shall be made by one or more of the following processes: open-hearth, basic-oxygen, or electric-furnace. Tensile strength tests, flattening test, hydrostatic tests shall be made for the materials to conform the requirements as specified. If the results of the mechanical tests do not conform to requirements specified, retests shall be made.1.1 This specification covers two types, seamless (S) and electric-resistance-welded (E), of steel pipe used as conduit for the installation of high-pressure pipe-type electrical cables in NPS 4 to NPS 12 [DN 100 to DN 300], inclusive, with nominal (average) wall thicknesses 0.219 to 0.562 in. [5.56 to 14.27 mm], depending on size. Pipe having other dimensions (Note 2) may be furnished, provided such pipe complies with all other requirements of this specification.NOTE 1: The dimensionless designator NPS (nominal pipe size) has been substituted in this standard for such traditional terms as “nominal diameter,” “size,” and “nominal size.”NOTE 2: A comprehensive listing of standardized pipe dimensions is contained in ASME B36.10.1.2 Pipe ordered under this specification is suitable for welding and for forming operations involving flaring, belling, and bending.1.3 Pipe for this purpose shall be furnished in Grade A or Grade B as specified in the purchase order. Grade A is more suitable for forming operations involving bending, flaring, or belling and this grade is normally preferred. This provision is not intended to prohibit the cold bending, flaring, or belling of Grade B pipe.1.4 This specification is expressed in both inch-pound units and in SI units; however, unless the purchase order or contract specifies the applicable M specification designation (SI units), the inch-pound units shall apply. The values stated in either inch-pound or SI units are to be regarded separately as standard. Within the text, the SI units are shown in brackets. The values stated in each system may not be exact equivalents; therefore each system shall be used independently of the other. Combining values from the two systems may results in nonconformance with the standard.1.5 The following hazard caveat applies to the test method portion, Section 20, of this specification: This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.1.6 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

定价： 590元 / 折扣价： 502 元 加购物车

1.1 Scope This International Standard states the requirements for both self-healing and non-self-healing continuously rated a.c. capacitors of up to and including 2.5 kvar, and not less than 0.1 μF, having a rated voltage not exceeding 1 000 V, which a

定价： 910元 / 折扣价： 774 元

5.1 Digital logic circuits are used in system applications where they are exposed to pulses of radiation. It is important to know the minimum radiation level at which transient failures can be induced, since this affects system operation.1.1 This guide is to assist experimenters in measuring the transient radiation upset threshold of silicon digital integrated circuits exposed to pulses of ionizing radiation greater than 103 Gy (matl.)/s.1.1.1 Discussion—This document is intended to be a guide to determine upset threshold, and is not intended to be a stand-alone document.1.2 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

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