
【国外标准】 IEC 61189-3: Test methods for interconnection structures (Printed boards) - Test E08: PTH resistance change, thermal cycling (IEC 52(Secretariat)477:1994)
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2025-06-05
- DIN IEC 52(Sec)477
- 废止
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适用范围:
暂无
标准号:
DIN IEC 52(Sec)477
标准名称:
IEC 61189-3: Test methods for interconnection structures (Printed boards) - Test E08: PTH resistance change, thermal cycling (IEC 52(Secretariat)477:1994)
英文名称:
标准状态:
废止-
发布日期:
2001-08-01 -
实施日期:
出版语种:
- 其它标准
- 上一篇: DIN IEC 52(Sec)475 IEC 61189-2: Test methods for materials for interconnection structures - Test M27: Resin flow properties of coverlay films, bonding films and adhesive cast films used in the fabrication of flexible printed wiring boards (IEC 52(Secretariat)475:1994)
- 下一篇: DIN ETS 300154 Terminal equipment (TE) - Terminal characteristics for the telematic file transfer within the teletex service (ITU-T Recommendation T.571, modified); English version ETS 300154:1994
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